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Black Potting Adhesive Sealant For Electronic Components Application

Black Potting Adhesive Sealant For Electronic Components Application The two components heat curing epoxy potting adhesive silicone mainly used for electronic components in the Automotive, lighting, LED etc. The feature for the potting glue: two components, heating curing, translucent,...

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Black Potting Adhesive Sealant For Electronic Components Application


The two components heat curing epoxy potting adhesive silicone mainly used for electronic components in the Automotive, lighting, LED etc.

 

The feature for the potting glue: two components, heating curing, translucent, automobile ignition coil epoxy adhesive. Low viscosity, easy penetration of defoaming, good permeability, good cracking resistance, and good insulating property, high temperature resistant.

 

Typical Applications of potting sealant:

Automobile ignition coil potting

 

Characteristic before curing

Representative value range

A component

Color Grey

Density g/cm3(25℃) 1.85 1.82~1.88

(GB/T13354-1992)

Viscosity mpa.s(25℃)400000 300000~500000

GB/T 2794-1995

B component

Color Yellow

Density g/cm3(25℃) 1.15 1.10~1.20

(GB/T13354-1992)

Viscosity mpa.s(40℃) 60 40~70

(GB/T 2794-1995)

Characteristic after mixing

Color Grey

Weight ratio A:B =100:28

Volume ratio A:B =100:44

Operation time 130g GB/T 7123.1-2002) ≥75

Condition of cure min(90℃,130g) 90℃@3h+130℃@3h

Characteristic after curing

Harness: Shore-D(GB/T 531-1999) 92

Glass-transition temperature℃ 142

GB/T 11998-1989

Volume Resistivity Ω·cm(25℃) 1.0×1015

GB/T1692-1992

Dielectric Strength KV/mm(25℃)(GB/T1692-1992) ≥25

Bending strength: Mpa 105

shock strength KJ/m2,(GB/T 1843-2008) 2.7

Shear strength Mpa(GB/T13930)≥7

 

Dielectric constant(25℃,1.2MHz,GB/T1692-1992)3.8

dielectric dissipation factor(25℃,1.2MHz) 0.012

GB/T1692-1992

Thermal conductivity W/m.K(25℃)(GB/T 11025-1989) 0.6

water absorption %(ISO 62) <0.1

Work Temperature℃ -40~150


Using diraction:


1. 1 glue injection: 90 ~ 100 ℃ preheated A component 2~3 hour(make sure adhesive hot enough, viscosity is low),Stir evenly inhaled or into the vacuum tank with agitator (Semi automatic filling and sealing potting process must first accurate weighing A component and then poured into tank). 80 ~ 90 ℃ while stirring vacuum for 2 to 3 hours(to no bubbles),keep warm and waiting to use.

A. semi automatic filling and sealing process: accurate weighing in component B, A:B =100:28,poured into which vacuum tank loaded accurately weighing A components,60 ~ 65 ℃ while stirring vacuum for 30 minutes,until no bubbles. Potting process begin, after potting Put in the oven to curing.

B. Automatic filling and sealing process:poured B component into which vacuum tank loaded accurately weighing A components, 35 ~ 45 ℃ while stirring vacuum for 30 minutes. Then adjust the A component and the B component of the discharge ratio(Weight ratio A:B =100:28;Volume ratio A:B =100:44),after ratio adjust, start inject adhesive,keep the temperature 60~65℃.After adhesive injection, put in the oven to curing.

2.Curing:put in 90℃ oven 3 hours, and slowly warming up to 130℃(warming up time keep in 30~40 minutes),curing in 130℃ 2.5~3 hours,after curing slowly cooling to 50℃, and take it out of oven(cooling time keep in 60 minutes).

 

Notice:

Every time mix adhesive need keep in 5-10KGS,mixed adhesive should completed in 1 hour. The Vacuum degree of vacuum tank and vacuum room should as low as possible.

 

Packing:

41kg/Set

A component glue 32kg/bucket. B component silicone sealant 9kg/bucket

 

Storage:

Store the silicone adhesive in dry and shady places at the temperature of 8~28℃.life time 12 months.




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