Huitian Technology Development Co., Limited

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Epoxy Potting Material For Electronic Components

As one epoxy sealer, the item number 6312 is black silicone sealant, two components, curing in the room temperature or heating, become to hard resin after curing, to proect the electric components. The procedure of curing is mild, less heat release than normal epoxy. Easy to operate, low shrinking, good levelling, very samll gap can be filling, and make the surface smoothly.

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Product Details

Epoxy Potting Material For Electronic Components

Characteristics


As one epoxy sealer, the item number 6312 is black silicone sealant, two components, curing in the room temperature or heating, become to hard resin after curing, to proect the electric components. The procedure of curing is mild, less heat release than normal epoxy. Easy to operate, low shrinking, good levelling, very samll gap can be filling, and make the surface smoothly.


Application:


Potting, for sealing and protecting in electric module which with flame resistance require, such as potted circuit board etc electronics potting .


Technical parameters:


1.jpg

Above data achieved after one day curing in 25, humidity 55%.


Feature:


Flame resistance is this electronic potting silicone outstanding feature.


Direction for using:


1, Before mixing, thermal potting compound A and B need to be stirring fully, suggest to preheat in the oven with 30-40℃.

2, Weighing A and B component according to the ratio, please don't mix the ratio unit, and then mixing fully.

3, Deaeration: vacuum deaeration: according to the real situation.

4, Dispensing: potting or dispense on the surface where needed, operate time will be different in different product, different temp, different ratio, please use up during the operation time, invoid to waste.

5, Washing and clean the tool and tank which for mixing and stirring, sealing A and B component which have not used out.


Notice:

1, Heating curing temp for the heat resistant sealant can't be higher than stipulate temp, otherwise it will be crack.

2, Silicone potting compound flowing and curing effected by temp, it may not curing below 10 degree.

3, The thermal conductive glue heat releasing during curing, the quantity of mixing glue is big, the heat releasing will be more, suggest to 200g.

4, Bubble removed in the silicone potting, the performance can be improved.


epoxy adhesive.jpg epoxy sealant.jpg epoxy glue.jpg


Ø         Contacts:

l         Mr. Alan Huang (Sales director)

l         Email: htsealant@gmail.com

l         Tel: 0086-185 8869 9763 / 0086-136 6248 1950 (WhatsApp)

l         Skype: allan2010_h

l         QQ: 838162458

l         Wechat: 0086-136 6248 1950

l         Web: www.htadhesive.com

l         Add (Office): ROOM 1502-07, EASEY COMMERCIAL BUILDING, 253-261 HENNESSY ROAD, 全景图WANCHAI, HONGKONG

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