Two Parts High Temperature Potting Compound Good Flame Resistance for Potted Circuit Board
Two parts high temperature potting compound good flame resistance for potted circuit board We are since 1977, started from Chinese Academy of Science, rich experience in the silicone sealant industry. The two components electronic potting silicone with the feature of low viscosity, good bonding...
Two parts high temperature potting compound good flame resistance for potted circuit board
We are since 1977, started from Chinese Academy of Science, rich experience in the silicone sealant industry. The two components electronic potting silicone with the feature of low viscosity, good bonding performance, meet the EU standard ROHS regulation.
Item name | Two component electronic potting silicone |
Packing | 5298 A component: 10kg/set. |
Characteristics | Low viscosity, can be cured in room temp and heating temp, curing fast if the temp more high. |
Advantage | No any by-product during curing phase. |
Application | Can be used for PC, PP, ABS, PVC etc material, mainly apply for big power electronic component, power module and circuit board which with requires on heat dissipation and heat resistance. |
Storage | 1, As one kind of chemical, please do keep away from kids. |
Direction for use | 1, Before mixing, stirring fully A and B component by manual or machine. |
Features:
Before curing | |||
Item | A component | B component | |
Appearance | White flow | Pale yellow flow | |
Viscosity (cP)(GB/T2794-1995) | 9000-11000 | 100-200 | |
After mixing | |||
Item | data | ||
Weight ratio | A:B=10:1 | ||
Viscosity (cP)(GB/T2794-1995) | 5500-4500 | ||
Operation time (25℃,min) | 240 | ||
Curing time (25℃,h) | 480 | ||
Curing time (80℃,min) | 30 | ||
After curing | |||
Item | data | ||
Hardness (shore A)(GB/T531-1999) | 35 | ||
Heat conductivity [ W/(m·K)] | 0.8 | ||
Dielectric strength (kV/mm)(GB/T1408.1-1999) | ≥20 | ||
Dielectric constant (1.2MHz) (GB-T 1694-1981) | 3.0-3.3 | ||
Volumn resistivity (Ω·cm)(GB/T1692-92) | ≥1.0×1016 | ||
Coefficient of linear expansion [m/(m·K)] | ≤2.2×10-4 |
R & D and production.
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