Two Parts High Temperature Potting Compound Good Flame Resistance for Potted Circuit Board

Packing

5298 A component: 10kg/set.
5298 B component: 1kg/set.

Characteristics

Low viscosity, can be cured in room temp and heating temp, curing fast if the temp more high.

Advantage

No any by-product during curing phase.

Application

Can be used for PC, PP, ABS, PVC etc material, mainly apply for big power electronic component, power module and circuit board which with requires on heat dissipation and heat resistance.

Storage

1, As one kind of chemical, please do keep away from kids.
2, Expiry date 12 months.
3, Placed in dry and shady place, avoid sun-baked and wringing.
4, Washing with water immediately if the silicone adhesive sealant spills into eyes or on the skin, and make a further handling.
5, Please use up once mixing AB together, avoid to waste.

Direction for use

1, Before mixing, stirring fully A and B component by manual or machine.
2, Weighing A and B component according to ratio, and mixing fully.
3, Deaeration: normal deaeration: keep the mixed glue 20-30mins, vacuum deaeration: vacuum level 0.08-0.1Mpa, vacuumize 5-10mins.
4, Dispensing: Make the surfcae clean and dry, complete dispensing during the operation time, otherwise effect the flowing.
5, Curing: in the room temp or heating, suggest to heat for curing in winter, curing 15min during 80～100℃. Curing 8 hours during room temp 25℃.

Item

A component

B component

Appearance

White flow

Pale yellow flow

Viscosity (cP)(GB/T2794-1995)

9000-11000

100-200

After mixing

Item

data

Weight ratio

A:B=10:1

Viscosity (cP)(GB/T2794-1995)

5500-4500

Operation time (25℃，min)

240

Curing time (25℃，h)

480

Curing time (80℃，min)

30

After curing

Item

data

Hardness (shore A)(GB/T531-1999)

35

Heat conductivity [ W/(m·K)]

0.8

Dielectric strength (kV/mm)(GB/T1408.1-1999)

≥20

Dielectric constant (1.2MHz) (GB-T 1694-1981)

3.0-3.3

Volumn resistivity (Ω·cm)(GB/T1692-92)

≥1.0×1016

Coefficient of linear expansion [m/（m·K）]

≤2.2×10-4