Structural AB Epoxy Adhesive For Wind Blade, Thixotropy Industrial Strength Glue
B Light Blue Thixotropic Paste
B Modified Amine
Operation Time (min, 23℃):
6168 wind blade structural adhesive (acrylic silicone/acrylic sealant/silicone/sealant/adhesive/potting sealant/potting adhesive/potting compound/UV glue/flange sealant/conductive sealant/Huitian adhesive/Huitian potting compound/huitian sealant/electrical sealant/electronic adhesive/epoxy sealant/epoxy adhesive/PU adhesive) is two component epoxy adhesive, high-thixotropic, light green, high toughness, high strength epoxy adhesive.
GRP and FRP adhesive such as fan blade mold, yachts, sports equipment..
Characteristics before curing
Typical values range
Appearance light yellow high thixotropic paste
Chemical Composition modified epoxy resin
Density 23℃(GB/T 15223-2008) 1.27
Viscosity (mPa.s) (GB/T 22314-2008) 470000
Appearance light blue thixotropic paste
Chemical Composition modified amine
Density 23℃(GB/T 15223-2008) 1.20
Viscosity (mPa.s) (GB/T 22314-2008) 450000
Appearance light green thixotropic paste
weight ratio A:B=100:50 A:B=100:52±2
Operation time (min, 23℃) 199
Curing time (h, 75℃)6
Characteristics after curing(23℃, 50%RH)
Shear strength (MPa,Al-Al) (GB/T 7124-2008)
Tensile strength (body, 23℃, MPa)58
(ISO 527-2:1993) 44
The tensile modulus (body, 23℃,GPa)
(ISO 527-2:1993) 4.82
T- peel strength(N/mm, Al-Al)(GB/T 1692-2008)
distortion temperature(℃) 69
glass transition temperature(℃) 75.4
flow(5℃-40℃): 5cmLift not sag
Surface preparation: It can be directly used for non-porous surface. Porous or absorbent surface should be mixed with a resin liquid filled pores after class.
Mixing: mix with weight ratio of A:B=100:50, the
increase or decrease outside the allowance in the
amount of curing agent will accelerate or reduce the
rate of curing, leading to incompletely curing. This
can not be modified again. A and B must be mixed
very evenly, until no turbidity is visible. Yellow A andblue B can be visually recognized. Special attention should be paid to the bottom and wall of the mixing vessel. It is very difficult to mix a lot of glue by hand because of the high viscosity. Mixing equipment is necessary to ensure a larger amount of glue for
Curing: Mixed plastic should be at 20-30 ℃, the surface temperature of the adhesive material should be controlled not more than 35 ℃. Before curing, remove the excess glue from the surface sticky. The curing process, the components should be heated slowly so that the internal stress of the adherend to a minimum. Thick layer (greater than 10mm) colloidal curing, need to consider a phased temperature curing in order to control the impact of concentrated heat. Temperature test center by layer, helping to set procedures to improve production efficiency and performance of the adhesive (acrylic silicone/acrylic sealant/silicone/sealant/adhesive/potting sealant/potting adhesive/potting compound/UV glue/flange sealant/conductive sealant/Huitian adhesive/Huitian potting compound/huitian sealant/electrical sealant/electronic adhesive/epoxy sealant/epoxy adhesive/PU adhesive) .
Please refer to the MSDS for detailed safety Information.
Order code: Shanghai
A 6168 200kg/ barrel, 2 barrels / box.
B 6168 200kg/ barrel, 2 barrels / box.
Stored in a cool, dry place at 8-28℃ for 24 months
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