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Adhesive compositions for electronic applications
- Nov 22, 2017 -

Adhesive compositions are used in integrated circuit (IC) chip assembly for various bonding and holding functions. Major applications are in bonding of leads of a lead frame and in attaching metal heat spreader plates to ICs. When the adhesivecomposition is used as an unsupported free film or as a double sided tape where the adhesive composition is coated on both sides of a backing film, it is commonly referred to as Electronic Adhesive Film (EAF). The adhesive composition also can be usedin the form of a single sided tape, where the adhesive composition is supported on one side of a backing film, for bonding the metal leads of a lead frame. Such tapes are commonly referred to as Lead Frame Tapes (LFT).

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